Optimization of Dispensing Parameter to Speed up the Die Attach Throughput
Journal of Engineering Research and Reports · pp. 39–44 · Published 3 Nov 2020
10.9734/jerr/2020/v18i117201Abstract
Driven by the company vision to become a high-volume manufacturing (HVM), increasing throughput in the manufacturing line is critical to meeting market demands. The ever-growing demand for integrated circuits in part requires additional capital investment to purchase new equipment such as die bonders to support the new requirement. Making the best of existing resources is often the most common approach to deal with this challenge. Defining the correct method and making the most of the secondary parameters necessary to increase the bonding speed by means of a creative analysis that made this article interesting. The objective of this project is to boost productivity by maximizing UPH to improve the epoxy writing process at Attach, which is a bottleneck area. Optimization of the dispensing sequence and the dispensing direction to improve and speed up the epoxy dispensing process unit per hour.
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