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Research Article Open access CC BY 4.0

Evaluating Performance of IC Packaging and Testing Firms by Bootstrap Data Envelopment Analysis

Erwin T. J. Lin

Journal of Scientific Research and Reports · pp. 1–13 · Published 7 Jan 2016

10.9734/JSRR/2016/23459

Abstract

Taiwan’s Integrated Circuit Packaging and Testing (ICPT) industry ranks number one in the world with 56% market share. However, facing the keen competition from global market, enhancing the operating performance becomes the most important way to be survival. As such measuring the efficiency deserves in-depth investigation. This paper adopts DEA and Bootstrap DEA methods to evaluate the performance for 24 global ICPT companies in 2010. The results show that, the average bias-corrected efficiency is slightly less than DEA efficiency. Based on the results some conclusions are drawn and recommendations for improving performance as well as the future study are proposed.

Data Envelopment Analysis (DEA) Bootstrap Data Envelopment Analysis (BDEA) IC packaging and testing.

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