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Erwin T. J. Lin

Publications (1)

Evaluating Performance of IC Packaging and Testing Firms by Bootstrap Data Envelopment Analysis

Erwin T. J. Lin · Journal of Scientific Research and Reports · 2016

Taiwan’s Integrated Circuit Packaging and Testing (ICPT) industry ranks number one in the world with 56% market share. However, facing the keen competition from global market, enhancing the operating performance becomes the most important way to be survival. As such measuring the...

Open access Research Article 10.9734/JSRR/2016/23459