Multi-Hole Process Plate Modification for Chip on Lead Device at Die Attach Process
E. Graycochea Jr., R. Rodriguez, F. R. Gomez, B. C. Bacquian
Journal of Engineering Research and Reports · pp. 7–10 · Published 10 Nov 2020
10.9734/jerr/2020/v18i317208Abstract
The paper focused on the improvement done in chip on lead (COL) leadframe package assembly manufacturing to address the leadframe bouncing effect during die attach process. A new and enhanced process plate is designed with multi-hole configuration to provide a strong vacuum underneath the leadframe and to maintain the planarity during dispensing and die bonding of silicon dies onto the leadframe. With the new multi-hole process plate, leadframe bouncing was successfully eliminated during die attach process. For future works, the multi-hole process plate could be used on devices with similar configuration.
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