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Journal of Engineering Research and Reports

Published by SCIENCEDOMAIN international · ISSN (electronic) 2582-2926

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500

Articles indexed

0

2026 articles

500

Open access

1,186

Citations (indexed)

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Articles (500)

Performance and Stability Analyses of TCP Queue Based Computer Network

Marvis Ijeaku Aririguzo & C. B. Mbachu · Journal of Engineering Research and Reports · 2020

This research work centers on the performance and stability analysis of the TCP queue based network system. The TCP is a vital organ in every wireless network and due to the increasing reliance on the wireless network by most human activities, it has suffered from different forms...

Open access Research Article 10.9734/jerr/2020/v17i417193

Compound Handling Automation: An Error Proof Solution in Eliminating Mold Misprocessing

Ernani D. Padilla & Emmanuel P. Birog · Journal of Engineering Research and Reports · 2020

This paper aims to identify and eliminate the weaknesses of the epoxy mold compound (EMC) thawing process that contributes to mold misprocessing occurrence such as wrong mold compound, under thawed or expired mold compound. Creation of automation solutions addressing high risk ar...

Open access Research Article 10.9734/jerr/2020/v17i417194

Analysis of Fastening Loads in Road Transport

Piotr Gorzelanczyk & Martyna Kujawa · Journal of Engineering Research and Reports · 2020

Introduction: The topic of the article is "Analysis of cargo securing in road transport". It consists of an analytical part and a research part, the assumption of which is to conduct a survey among people who have passed a number of requirements allowing to obtain the title of a...

Open access Research Article 10.9734/jerr/2020/v17i317188

Die Attach Film Bleed out Resolution through Process Optimization on DFN Packages

Bryan Christian S. Bacquian, Edwin M. Graycochea Jr. & Frederick Ray I. Gomez · Journal of Engineering Research and Reports · 2020

The development of new technology with thinner and smaller packages has become the movement and focus on semiconductor assembly industry. This paper presents an improvement done in dual-flat no-leads (DFN) package to resolve the quantity of rejection due to die attach film (DAF)...

Open access Research Article 10.9734/jerr/2020/v17i317189

Associating Unemployment with Panic Attack Using Deep Learning during COVID-19

Shawni Dutta & Samir Kumar Bandyopadhyay · Journal of Engineering Research and Reports · 2020

Corona Virus Infectious Disease (COVID-19) is newly emerging infectious disease. It is known to the world in late 2019. Due to this, the mental health of employees is disturbed. There is always a fear of unemployment amongst employees due to the present scenario of lockdown. This...

Open access Research Article 10.9734/jerr/2020/v17i317190

Pick and Place Process Defect Mitigation on Semiconductor BGA Device

Antonio R. Sumagpang Jr., Frederick Ray I. Gomez & Edwin M. Graycochea Jr. · Journal of Engineering Research and Reports · 2020

With the new devices and new technologies in semiconductor industry are getting more challenging to process because of new processes and process bricks. One of the most challenging assembly processes is the pick and place or the die attach process. Issues were encountered during...

Open access Research Article 10.9734/jerr/2020/v17i317187

Analysis of Ethylene Glycol (EG)-based ((Cu-Al2O3), (Cu-TiO2), (TiO2-Al2O3)) Hybrid Nanofluids for Optimal Car Radiator Coolant

J. A. Okello, W. N. Mutuku & A. O. Oyem · Journal of Engineering Research and Reports · 2020

Coolants are vital in any automotive since they manage the heat in the internal combustion of the engines by preventing corrosion in the cooling system as well as assist in eradicating the engine’s waste heat. This paper examines three different types of ethylene glycol-based hyb...

Open access Research Article 10.9734/jerr/2020/v17i217186

Integration of EMI Shielding Design for Substrate Package Isolation

Frederick Ray I. Gomez & Rennier S. Rodriguez · Journal of Engineering Research and Reports · 2020

This paper presents a modified substrate design that would enable a bottom electromagnetic interference (EMI) shielding protection for EMI sensitive integrated unit (IC). The modified substrate design is applied and incorporated to the existing and known shielding technique to fu...

Open access Research Article 10.9734/jerr/2020/v17i217184

The Effect of Soil Poissons Ratio on the Response of Buildings with Sufficient Embedment Depth

Ahmed Hafiz Yasseen Essawy · Journal of Engineering Research and Reports · 2020

The present study highlights the effect of soil poissons ratio on the response of buildings with sufficient embedment depth. The interaction effect between the structure and its foundation control the dynamic behavior of the structure during seismic analysis. Not only the foundat...

Open access Research Article 10.9734/jerr/2020/v17i217185