During processing of Quad Flat No-lead (QFN) on the production line, it has been observed that strips were found with bent rails after the molding process. Mold is a process in the semiconductor industry where package encapsulation happens by filling the cavities with molding com...
Open access
Research Article10.9734/jerr/2022/v22i1117573
Tape saw singulation is the process where a strip was mounted on the tape attached on the frame and then sawn into single units. Circular tape saw singulation only caters one panel of the two-paneled strip which was found to be consuming with the machine capacity and resources. D...
Open access
Research Article10.9734/jerr/2021/v20i717341
Land grid array or LGA package of semiconductor has been commonly used on our modern technology, from home gadgets up to industrial uses. Improvements to correct product defects and process issues are introduced to have quality products for customer satisfaction. Substrate warpag...
Open access
Research Article10.9734/jerr/2022/v23i317600