Wirebond Process Optimization through Stitch Relocation on QFN Package
A. Moreno, E. Graycochea Jr. & F. R. Gomez · Journal of Engineering Research and Reports · 2020
One of the most challenging assembly manufacturing process in semiconductor industry is wirebond process using a wire as direct material. With this new technology, some issues were encountered during the first trial of a quad flat no-leads (QFN) package. This paper is focused on...
Open access
Research Article
10.9734/jerr/2020/v19i217228