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All published articles 500

Design and Development of Mini-pulsar for Real-Time Bioelectric Experiment

Gyanendra Kumar, R Sarathi & Archana Sharma · Journal of Engineering Research and Reports · 2021

Investigation of the effect of pulsed electric field on eukaryotic cells has been of interestto biomedical scientists and researchers since a few decades. Reversible electroporation (EP) is used for uptake of chemicals, drugs, DNA into the eukaryotic cells under low electric fiel...

Open access Research Article 10.9734/jerr/2021/v20i617322

Reducing the effects of Power Harmonics on Distribution Transformers using Simplex Optimization Technique

N. B. Ngang & N. E. Aneke · Journal of Engineering Research and Reports · 2021

There have been incessant power failures in our power network, which has arisen as a result of over current, over voltage, harmonic distortion caused by ripples to mention a few, This could be overcome by determining the harmonic mean from a given harmonic distortion data ,optimi...

Open access Research Article 10.9734/jerr/2021/v20i617321

Biochemical Methane Potential Assessment by Anaerobic Digestion of Locally Available Grasses of Phuentsholing, Bhutan

Yeshi Choden, Samten Zangmo, Saahin Tamang, Thinley Gyeltshen, Karma Phuntshok, Sanjita Limboo & Tenzin Choden Gyeltshen · Journal of Engineering Research and Reports · 2021

Renewable energy is not only environmental friendly but also promotes sustainable development. Biogas being one of the abundantly used renewable resource, the enhancement and optimization of the yield of biogas can help in reduction of dependence on imported fuel. Biochemical met...

Open access Research Article 10.9734/jerr/2021/v20i517320

Investigation of the Adsorption Potentials of an Organic Adsorbent for Phenol Removal from Aqueous Solution

C.E. Muko-Okoro, I.A. Obiora-Okafo & J.N. Ndive · Journal of Engineering Research and Reports · 2021

Phenol is a prevalent pollutant found in many industrial wastewaters, and it is paid singular attention because of its special features including high toxicity, carcinogenic properties, and vital cumulative ability that affects the health of humans and the environment. The curren...

Open access Research Article 10.9734/jerr/2021/v20i517318

Small Pilot System for the Manufacture of in Situ Precipitated Calcium Carbonate in the Presence of Pulp Fibers

Klaus Dölle & Bardhyl Bajrami · Journal of Engineering Research and Reports · 2021

Paper fillers materials are less expensive than fiber, allowing reduced production costs and improvement of paper properties. A small pilot scale in-situ laboratory calcium carbonate filler precipitation unit was developed and designed with the objective to provide enough pulp fi...

Open access Research Article 10.9734/jerr/2021/v20i517317

Comparative Analysis of Some Existing Models for Estimating the Time of Concentration for Watersheds in Anambra State, Nigeria

J. C. Agunwamba & N. C. Mmonwuba · Journal of Engineering Research and Reports · 2021

This study considered the estimation of the time of concentration (TC) using 30 different watersheds in Anambra State, Nigeria. The study assessed the performance of some existing models for the estimation of time of concentration in the study area. Data for this research were co...

Open access Research Article 10.9734/jerr/2021/v20i517314

Flood Flow Probability Distribution Model Selection on Niger/Benue River Basins in Nigeria

Itolima Ologhadien · Journal of Engineering Research and Reports · 2021

Flood frequency analysis is a crucial component of flood risk management which seeks to establish a quantile relationship between peak discharges and their exceedance (or non-exceedance) probabilities, for planning, design and management of infrastructure in river basins. This pa...

Open access Research Article 10.9734/jerr/2021/v20i517315

Die Attach Process Robustness through Epoxy Pattern Optimization for DFN Device

Jerome J. Dinglasan & Frederick Ray I. Gomez · Journal of Engineering Research and Reports · 2021

As the modern world evolves through innovation and technology, manufacturing companies of semiconductor drive their people to dedicate themselves on continuous improvement and technical advancement. Products they produce becomes smaller and thinner, but applications are limitless...

Open access Research Article 10.9734/jerr/2021/v20i517313

Modeling Study on the Impact of Mold Thickness on Strip Warpage of a Molded Leadframe Package

Jefferson Talledo · Journal of Engineering Research and Reports · 2021

Strip warpage is a common problem in molded leadframe packages. When warpage becomes excessive, the strip could not be processed as it would result in the strip being stuck or damaged during loading to the handling machine loader. This study focuses on the impact of mold cap thic...

Open access Research Article 10.9734/jerr/2021/v20i517312

Study of the Impact of Curing Condition on Flexural Strength of a Very Thin Semiconductor Package

Jefferson Talledo · Journal of Engineering Research and Reports · 2021

Thinner semiconductor package is becoming popular especially in consumer electronics applications. As package becomes thinner, it is more vulnerable to package crack when subjected to external load. It is important to ensure that the package is strong enough to resist package cra...

Open access Research Article 10.9734/jerr/2021/v20i517311

Die Placement Performance Evaluation on Different Machine Platforms

Rennier Rodriguez, Edwin Graycochea Jr. & Frederick Ray Gomez · Journal of Engineering Research and Reports · 2021

The paper focuses on the die placement tolerance capability with critical design for land grid array (LGA) device evaluated on two different die attach machine platforms. The evaluation was narrowed down into two main die attach machines with the objective of attaining the best p...

Open access Research Article 10.9734/jerr/2021/v20i517310

Introduction of Laser Pi-Grooving as Breakthrough Solution to Enhance die Strength of 40 nm ulow-k CMOS Silicon Technology during Wafer Saw Process

Aiza Marie E. Agudon, Hynlie B. Inguin & Bryan Christian S. Bacquian · Journal of Engineering Research and Reports · 2021

Nowadays, semiconductors and electronics are becoming part of our everyday activities. As the Integrated circuits become more useful to people, it also requires more function, which contain more complex and compact components. Aligned to this package requirement, the more challen...

Open access Research Article 10.9734/jerr/2021/v20i517308

Improvement on QFN Leadframe Design of Extended Leads to Support the Mitigation of Mold Flash Occurrence

Alyssa Grace Gablan, Frederick Ray Gomez & Anthony Moreno · Journal of Engineering Research and Reports · 2021

Parameter optimization is not only the key to find the most favorable and best solution as variable chances of failure modes may happen at extreme case conditions at unexpected period. Packaging design robustness is much resilient to establish a satisfactorily good quality produc...

Open access Research Article 10.9734/jerr/2021/v20i517309

Predicting Silicon Die Breaking Force in Semiconductor Package Assembly through Mechanical Simulation

Jefferson Talledo · Journal of Engineering Research and Reports · 2021

Die crack is a common problem in the semiconductor industry and being able to predict the breaking force at a given loading condition could help prevent such crack problem. This paper presents the use of mechanical simulation in predicting the force at which the silicon die break...

Open access Research Article 10.9734/jerr/2021/v20i517307