The paper industry around the world is in search for new ways to decrease production costs. New approached with additives such as new developed In Situ precipitated paper fillers materials have the potential to reduce production cost and increase profit margins. In Situ precipita...
Open access
Research Article10.9734/jerr/2021/v20i817352
The paper focused on the evaluation of quad-flat no-leads (QFN) device in tapeless leadframe technology on different diebonder platforms to achieve an acceptable fillet height performance. The study was narrowed down into two main machines with the objective of attaining a fillet...
Open access
Research Article10.9734/jerr/2021/v20i817353
Intermetallic coverage (IMC) is one of the critical wirebond output responses that is usually checked to ensure the ball to pad integrity. The success of wirebonding relies on the formation of an interfacial intermetallic growth of ball bond to ensure it can withstand reliability...
Open access
Research Article10.9734/jerr/2021/v20i717351
Package singulation process is where the whole strip was sheared to produce individual units. Existing singulation program for 1-map strip have only six (6) pattern recognition system (PRS) points along the whole strip with 240 mm length. Considering the length of the strip, it i...
Open access
Research Article10.9734/jerr/2021/v20i717349
Semiconductor Companies and Industries soar high as the trend for electronic gadgets and devices increases. Transition from “manual” to “fully automatic” application is one of the advantages why consumer adapt to changes and prefer electronic devices as one of daily answers. Indi...
Open access
Research Article10.9734/jerr/2021/v20i717350
This paper utilizes a modern regular and modular eight-variable Karnaugh map in a systematic investigation of cause-effect relationships modeled by partially-defined Boolean functions (PDBF) (known also as incompletely specified switching functions). First, we present a Karnaugh-...
Open access
Research Article10.9734/jerr/2021/v20i717348
Rice aggregation centers are tasked with checkmating substandard agricultural produce that are often encountered by the integrated millers during the course of buying from farm to farm to ensure already made market for their produce. Thus, it must be well placed to occupy strateg...
Open access
Research Article10.9734/jerr/2021/v20i717347
In unconfined aquifer water flows in both horizontal and vertical direction when pumping. So its study during pumping action is more complex. Soil type, porosity, hydraulic conductivity and transmissivity are important parameters that control the specific yield, drawdown and radi...
Open access
Research Article10.9734/jerr/2021/v20i717346
This paper discusses the modeling approach used in improving the solder joint reliability prediction for Quad Flat No Lead (QFN) packages. A new power equation fatigue prediction model was developed based on the accumulated creep strain energy density from FEA (finite element ana...
Open access
Research Article10.9734/jerr/2021/v20i717344
This paper introduces modeling and simulation of the harmonic and intermodulation distortions of semiconductor laser radiating an optical fiber link. The study is based on the rate equation model of semiconductor lasers excited by injection current with two sinusoidal tones separ...
Open access
Research Article10.9734/jerr/2021/v20i717342
Today, semiconductor world is becoming more inclined to thinner Integrated Circuit (IC) packages. IC packages will require thinning of the internal configuration of the package, which involves the die or the wafer and the adhesive material, which is the Die Attach Film (DAF). Ali...
Open access
Research Article10.9734/jerr/2021/v20i717343
Stainless steel is an alloy of steel which contains at least 10.5% chromium, less than 1.2% carbon, and other alloying elements. It is widely used in many industries globally and their properties are highly influenced by their microstructure, heat treatment or by plastic deformat...
Open access
Research Article10.9734/jerr/2021/v20i717339
With the continuous trend of new technologies in semiconductor manufacturing assembly, challenges and issues are unavoidable. This paper presents the modification and improvement done on the process plate design to eliminate the bouncing effect of the silicon die that leads to of...
Open access
Research Article10.9734/jerr/2021/v20i717340
Tape saw singulation is the process where a strip was mounted on the tape attached on the frame and then sawn into single units. Circular tape saw singulation only caters one panel of the two-paneled strip which was found to be consuming with the machine capacity and resources. D...
Open access
Research Article10.9734/jerr/2021/v20i717341
Shopfloor practices that when the first cut line was aligned with the hairline, actual blade cut, and saw street of the strip, the succeeding cut lines will automatically follow with the same alignment. Considering various factors that affect the condition of the strip, it was re...
Open access
Research Article10.9734/jerr/2021/v20i717337