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All published articles 500

Effect of Polymer Additive on Nano Materials Modified Asphalt Mixtures

Ahmed E. Abu El-Maaty, Mohammed E. Ouf & Saddam Shahrah · Journal of Engineering Research and Reports · 2020

Recently, by the increase of traffic volumes and tonnages, modern axle arrangements and more wheel compressions, the needs to the highway asphaltic pavements have increased, requiring an improvement in the performance of asphaltic materials. With a view to enhance the performance...

Open access Research Article 10.9734/jerr/2020/v11i317061

Investigative Analysis of Marine Tugboat Accident in Nigeria. A Case Study of Bayelsa, Delta and Rivers State

Clement A. Idiapho & Sani I. Awwal · Journal of Engineering Research and Reports · 2020

The research paper showed that the major causes of boat and ferry accidents in Nigeria include human factor errors, natural factors, and technical factors. The safety of life and navigation at sea are important to coastal, flag states and the entire international shipping communi...

Open access Research Article 10.9734/jerr/2020/v11i317062

The Study of Recognition Methods Based on Wavelet Transform for Melanoma Detection

Maen Almarei & Khaled Daqrouq · Journal of Engineering Research and Reports · 2020

Skin cancer is one of the most cancers occurring in the world. Malignant melanoma is the most skin cancer type causing death around the world. Melanoma could be treated 100% if they are detected at earlier stages. In this paper, various melanoma detection systems were reviewed ac...

Open access Research Article 10.9734/jerr/2020/v11i317063

Process Enhancement to Eliminate Adhesive Film Remains during Die Picking

E. Graycochea Jr., B. C. Bacquian & F. R. Gomez · Journal of Engineering Research and Reports · 2020

Adhesive film remains on the dicing tape is one of the problems encountered in diebonding or die attach process during the pick-up process of silicon dies. With this occurrence, one method used to identify the root cause is the process mapping from wafer preparation to diebonding...

Open access Research Article 10.9734/jerr/2020/v11i317057

Analysis of the Gaseous Emissions and the Residues Generated under Oxy-fuel Combustion of Biomasses in a Drop Tube Furnace (DTF)

Glauber Cruz & Paula Manoel Crnkovic · Journal of Engineering Research and Reports · 2020

Some environmental problems are caused by pollutants from thermoelectric plants, mainly by burning fossil fuels. Alternatives for reducing such emissions are discussed worldwide and using green fuels is a promising way. Five biomasses (pine sawdust, sugarcane bagasse, coffee and...

Open access Research Article 10.9734/jerr/2020/v11i217058

Package Design Improvement for Wire Shorting Resolution

A. Sumagpang Jr., E. Graycochea Jr. & F. R. Gomez · Journal of Engineering Research and Reports · 2020

New devices and new technologies in semiconductor industry are getting more complex in terms  of package layout, direct materials, and process capability. With the package design complexity, several issues are encountered during the development, and in turn affecting the overall...

Open access Research Article 10.9734/jerr/2020/v11i217059

A Path to Renewable Energy from the Energy Crisis in Bangladesh

Zafrin Ahmed Liza, Hajera Akhter, Md. Shahibuzzaman & Mohammad Rakibul Islam · Journal of Engineering Research and Reports · 2020

Bangladesh is facing a tremendous energy crisis and the economic development of this country was jeopardized due to the lack of energy resources. Due to the progression of technology, the depletion of power is rising continuously. Adequate and consistent source of electricity is...

Open access Research Article 10.9734/jerr/2020/v11i217055

Implementation of Pads Re-layout for QFN Multi-row Breakthrough

R. Rodriguez, F. R. Gomez & M. G. Maming · Journal of Engineering Research and Reports · 2020

An alternative design of Quad-Flat No-lead (QFN) leadframe capable with three or more arrays of lead is discussed and presented on this paper. The leadframe design is integrated with connecting bars that can be routed and bonded with wires to decrease the wire span and create a m...

Open access Research Article 10.9734/jerr/2020/v11i217056

Interconnect Technique for Tight Clearance in Stacked-die Package

F. R. Gomez, R. Rodriguez & N. Gomez · Journal of Engineering Research and Reports · 2020

The paper focused in addressing wire-related assembly issues due to tight clearances in the semiconductor package design. Package design characterization was done considering the assembly design rules and the advanced rules, resulting to the integration of an interposer in the pa...

Open access Research Article 10.9734/jerr/2020/v11i217054

Effect of Grid Instability on Power Generation System's Reliability

Joseph Benedict Bassey & Isaac F. Odesola · Journal of Engineering Research and Reports · 2020

Aims: Reliability assessment of power generation system may be performed with the concept of system adequacy, security or both. Grid being a major component in the power distribution chain is seen to have some influence on the state of the generation system reliability because of...

Open access Research Article 10.9734/jerr/2020/v11i117053

Design of Sequencing Batch Reactor (SBR) Treatment Plant for Abattoir Wastewater (A Case of Apa Mmini Stream)

Ogbebor Daniel & Ndekwu, Benneth Onyedikachukwu · Journal of Engineering Research and Reports · 2020

Aim: The study aimed at designing a wastewater treatment method for removal of (Biological Oxygen Demand) BOD5 using Sequencing batch reactor (SBR). Study Design: SBR functions as a fill-and-draw type of activated sludge system involving a single complete-mix reactor where all st...

Open access Research Article 10.9734/jerr/2020/v11i117050

Die Attach Process Analysis of Enhanced Stand-off Stopper on Tapeless Leadframe

E. Graycochea Jr., F. Gomez, R. Rodriguez & B. Bacquian · Journal of Engineering Research and Reports · 2020

Improvement on the process and design is often a reliable way to resolve a problem especially in semiconductor industry. This paper presents a leadframe or semiconductor carrier merged with a stand-off design structure that will maintain a consistent bond line thickness (BLT) cri...

Open access Research Article 10.9734/jerr/2020/v11i117051

Bio-tower Application for Wastewater Treatment

Klaus Doelle, Yue Qin & Qian Wang · Journal of Engineering Research and Reports · 2020

The study tested the performance of a batch-type recirculating laboratory scale bio-tower for the treatment of municipal wastewater. Performance tests were done with a HACH DR-1900 spectrophotometer include chemical oxygen demand, total phosphorus and nitrogen ammonia. This study...

Open access Research Article 10.9734/jerr/2020/v11i117048

A Study of the Effect of Back Grind Wheels on Wafer Edge Chippings and Die Strength

Bryan Christian S. Bacquian · Journal of Engineering Research and Reports · 2020

The drive for thinner package architecture is already becoming a necessity. There were a need of thinner Integrated Circuit or IC in order to fit in to thinner applications like mobile phones. One of the major semiconductor process that enables miniaturization was wafer back grin...

Open access Research Article 10.9734/jerr/2020/v11i117049

Comparative Studies of Two Developed On-farm Solar Dryers for Vegetables

S. A. Okaiyeto, Y. A. Unguwanrimi, S. I. Ogijo, B. J. Jonga & A. M. Sada · Journal of Engineering Research and Reports · 2020

This research work was carried out to provide local farmers with on-farm solar dryers to minimize post-harvest losses of vegetables. Two dryers (Mixed mode and Indirect mode on-farm solar dryers) were constructed using locally available materials. The dryers basically consist of...

Open access Research Article 10.9734/jerr/2020/v10i417046