Mitigating Wire Short Defect on LGA Device through Substrate Design Optimization

References (10)

1. 1 Fine pitch probing and wirebonding and reliability of aluminum capped copper bond pads [DOI]
2. 2 Reliability of Copper, Gold, Silver, and PCC Wirebonds Subjected to Harsh Environment [DOI]
3. 3 Enhanced Loop Height Optimization for Complex Configuration on QFN Device [DOI]
4. 4 Understanding Non-Stick on Lead Wirebond Failure Due to Leadfinger Surface Roughness [DOI]
5. 5 The behavior of FAB (free air ball) and HAZ (heat affected zone) in fine gold wire [DOI]
6. 6 Wirebond Process Improvement with Enhanced Stand-off Bias Wire Clamp and Top Plate [DOI]
7. 7 Wire Shorting Elimination through Wirebond Process Optimization of Semiconductor Sensor Device [DOI]
8. 8 Non-stick on Pad Defect Reduction through Clamp and Insert Design Augmentation [DOI]
9. 9 Wirebonding Characterization and Optimization on Thick Filmsu-8 MEMS Structures and Actuators [DOI]
10. 10 Non-continuous IMC in copper wirebonding: Key factor affecting the reliability [DOI]

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