Implementing Single-Row Process Plate Design for Pre-Encapsulated Lead Frame
R. Rodriguez, F. R. Gomez, J. Pulido
Journal of Engineering Research and Reports · pp. 26–30 · Published 25 Aug 2020
10.9734/jerr/2020/v16i217162Abstract
This paper presents the application of an innovative design of wirebond process plate during wirebonding process of thin semiconductor carrier such as the pre-encapsulated leadframe. The implementation of the specialized process plate aims to improve the conventional method of wirebonding from panel type to single-row design to reduce the occurrence of warpage on thin leadframes. In this study, an 85% reduction for warpage level is achieved after the introduction of the new design of process plate. Future works could use the improved process plate design for devices of similar configuration.
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