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Journal of Engineering Research and Reports

Published by SCIENCEDOMAIN international · ISSN (electronic) 2582-2926

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500

Articles indexed

0

2026 articles

500

Open access

1,191

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Articles (500)

Optimization of Mild Steel Welding Process Parameters Using Multivariate Linear Regression

William E. Odinikuku, David Atadious & Ikechukwu P. Onwuamaeze · Journal of Engineering Research and Reports · 2020

Local welders in Nigeria are prone to poor quality weldment because of their lack of welding technical skills. When these local welders carry out their welding operation, the welded joints are considered to be good enough because the metal materials welded together are seen to be...

Open access Research Article 10.9734/jerr/2020/v10i217036

Warpage Mitigation through Diebond Process Improvement with Enhanced Leadframe Configuration

Edwin M. Graycochea Jr., Frederick Ray I. Gomez & Rennier S. Rodriguez · Journal of Engineering Research and Reports · 2020

This paper presents an improvement in the design of quad flat no-leads (QFN) leadframe material to reduce the amount of unit rejection due to excessive leadframe warpage observed after die attach curing (DAC) process. The enhanced leadframe design includes modification through in...

Open access Research Article 10.9734/jerr/2020/v10i217035

A Comparative Study on the Developmental Trends in the Contemporary Iranian Architecture; Case Study-Khosrawi Leather Factory of Tabriz

Shayan Mahmoudi, Ali Rezvani & Mehdi Niknam · Journal of Engineering Research and Reports · 2020

Architecture and urbanization are representatives of our architectural and cultural histories. Many of the lost historical characteristics can come out of the back door citing such representatives. Reconstruction and restoration are a set of activities that deal with the body and...

Open access Research Article 10.9734/jerr/2020/v10i217032

Modified Sidewall Design of QFN Package

Frederick Ray I. Gomez & Rennier S. Rodriguez · Journal of Engineering Research and Reports · 2020

The paper offers an improvement for leadframe devices to mitigate the occurrence of package chipping rejection during package mechanical singulation. The discussion provides a specialized design of mold chase for mold encapsulation process, and an augmented mechanical cutting tec...

Open access Research Article 10.9734/jerr/2020/v10i217033

Die Attach Assembly Process Tool Advancement

Frederick Ray Gomez, Rennier Rodriguez & Nerie Gomez · Journal of Engineering Research and Reports · 2020

Die attach film (DAF) voids detection is one of the challenges during the introduction of non-conductive adhesives for integrated circuit products affecting production control robustness and detection. In this paper, a specialized tool capable to distinguish and quantify the amou...

Open access Research Article 10.9734/jerr/2020/v10i117031

Laser DAF Cut Augmentation for Thin Wafers

Bryan Christian Bacquian & Frederick Ray Gomez · Journal of Engineering Research and Reports · 2020

The semiconductor industry is becoming more inclined to thinner integrated circuit (IC) packages. Thinner packages with thin wafer or die prefer the die attach film (DAF) technology as the die adhesive material solution. As the wafer goes thinner, it becomes more of a challenge i...

Open access Research Article 10.9734/jerr/2020/v10i117029

Behavior of Foundations on Reinforced Sabkha Soil: A Numerical Study

Lamia Sadek & Khaled M. M. Bahloul · Journal of Engineering Research and Reports · 2020

The aim of this research is to investigate numerically the behavior of strip footings resting on Sabkha soil reinforced using two methods. Firstly, using a layer of compacted sand reinforced with random distributed fibers beneath footing. Secondly, using a layer of compacted sand...

Open access Research Article 10.9734/jerr/2020/v10i117028

Package and Process Design Augmentation of QFN Leadframe Device

Rennier S. Rodriguez, Maiden Grace R. Maming & Frederick Ray I. Gomez · Journal of Engineering Research and Reports · 2020

Innovations and breakthroughs either through process, equipment or material is known in semiconductor industries as a positive option in overcoming the existing limitations and assembly handicaps. This presentation discusses the assembly methodology and packaging design of a quad...

Open access Research Article 10.9734/jerr/2019/v9i417026