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Journal of Engineering Research and Reports

Published by SCIENCEDOMAIN international · ISSN (electronic) 2582-2926

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1,996

Articles indexed

266

2026 articles

1,996

Open access

7,580

Citations (indexed)

Publications by year

Articles (1996)

Performance of Trickle Irrigation System on Growth and Yield of Garlic in Case Rabi and Kharif Seasons, Wonkakebele, Ethiopia

Dessie Gieta Amare · Journal of Engineering Research and Reports · 2020

Trickle irrigation is one and only of the water saving, progressive and advanced irrigation methods over gravity irrigation. In the point view of this, the research was lead to study the efficiency of Trickle irrigation over gravity irrigation in growth and yield of garlic in cas...

Open access Research Article 10.9734/jerr/2020/v13i117094

Clients Versus Consultants Assessment of Project Success in Nigeria

Ayodele Emmanuel, Ikudayisi & Akugbe Collins, Oviasogie · Journal of Engineering Research and Reports · 2020

The effectiveness of project delivery depends largely on the collaboration of the project actors. Yet the perception of success might be subjective and dependent on the individual’s opinion. This study assessed project success from clients versus consultants’ perspective. A cross...

Open access Research Article 10.9734/jerr/2020/v13i117093

A Review on Performance of Rice De-stoning Machines

O. A. Adetola & D. L. Akindahunsi · Journal of Engineering Research and Reports · 2020

The major challenge in Nigerian rice industry is poor processing which allows contaminants such as stone pebbles to be introduced during harvesting and post-harvest handling. Despite the several efforts of various researchers in Nigeria, no commercial rice de-stoning machine is a...

Open access Research Article 10.9734/jerr/2020/v13i117090

An Attempt to Modify the Crop Coefficient Value of Wheat and Chickpea for Humid Subtropical Climate of Varanasi District, Uttar Pradesh

Chandra Kishor Kumar, Gaurav Sharma & Anshu Gangwar · Journal of Engineering Research and Reports · 2020

Crop water requirement is one of the essential components that should always be taken into account wherever water management strategies are adopted for effective utilization of water. In India agriculture is considered as the backbone of economy but nothing technical or advance t...

Open access Research Article 10.9734/jerr/2020/v13i117091

Wind Analysis of High-Rise Building Resting on Sloping (Hilly) Grounds of Federal Capital Territory, Abuja, Nigeria

Roy O. Ononye, Kevin C. Okolie, F. O. Ezeokoli & S. C. Ugochukwu · Journal of Engineering Research and Reports · 2020

The importance of wind induced vibration is a key factor in the analysis, design and construction of high-rise building structures. Owing to scarce land resources, urbanization and ever-growing demand for accommodation is leading developers into sloping (hilly) grounds which in t...

Open access Research Article 10.9734/jerr/2020/v13i117092

Behaviour of RC Moment Resisting Regular and Irregular Framed Structures Situated Near and Far to Fault Zone

K. J. Harshitha, R. Sunil & Avinash Gornale · Journal of Engineering Research and Reports · 2020

Near fault earthquake record are rich in high frequencies that effects structures for far fault earthquake record lower frequencies is not effects highly in structure. The objective of the study is to be investigating the effect of near-fault and far fault earthquake motion on th...

Open access Research Article 10.9734/jerr/2020/v12i417087

A Study of Micro-crack on Surface Mount IC Package

Antonio Sumagpang Jr., Frederick Ray Gomez & Edwin Graycochea Jr. · Journal of Engineering Research and Reports · 2020

In integrated circuit (IC) manufacturing industry, package micro-crack and other crack-related flaws are common defect frequently encountered in trim and form process of a surface mount IC package. This paper focused on the prevention of the micro-crack occurrence as it affected...

Open access Research Article 10.9734/jerr/2020/v12i417086

Specialized Wirebond Process Configuration on Advanced Multi-Die Package

Anthony R. Moreno, Edwin M. Graycochea Jr. & Frederick Ray I. Gomez · Journal of Engineering Research and Reports · 2020

Wirebonding process is one important assembly process responsible for providing electrical connections between the silicon die and the external leads of a semiconductor package or device. The process also brings along some challenges as the device becomes more complex and critica...

Open access Research Article 10.9734/jerr/2020/v12i417084