Die attach epoxy dispensing is an automated factory environment that creates some special challenges. A robust production process begins with an understanding of the adhesives in their fluid state and which important parameters must be controlled. One of the most common problems...
Open access
Research Article10.9734/jerr/2020/v17i417196
This paper presents the modification and improvement done on the wire clamp and top plate (WCTP) design to eliminate the bouncing effect of the silicon die that leads to smashed ball reject during the formation of wire. The protrusion of the unit on the vacuum hole produced movem...
Open access
Research Article10.9734/jerr/2020/v17i417195
Heat-generating equipment (such as transformers, computer microchips, car engines, nuclear reactors, etc.) requires an efficient cooling mechanism to safeguard them from thermal degradation and to enhance their life span. The use of Nanofluids as opposed to conventional heat tran...
Open access
Research Article10.9734/jerr/2020/v17i417192
This research work centers on the performance and stability analysis of the TCP queue based network system. The TCP is a vital organ in every wireless network and due to the increasing reliance on the wireless network by most human activities, it has suffered from different forms...
Open access
Research Article10.9734/jerr/2020/v17i417193
This paper aims to identify and eliminate the weaknesses of the epoxy mold compound (EMC) thawing process that contributes to mold misprocessing occurrence such as wrong mold compound, under thawed or expired mold compound. Creation of automation solutions addressing high risk ar...
Open access
Research Article10.9734/jerr/2020/v17i417194
Ergonomic assessment tools are crucial for evaluation of biomechanical risk factors at workplaces to understand the contributing factors and reduce the prevalence of musculoskeletal disorders (MSDs) which have negative implications on employees’ health and productivity. This revi...
Open access
Research Article10.9734/jerr/2020/v17i317191
Introduction: The topic of the article is "Analysis of cargo securing in road transport". It consists of an analytical part and a research part, the assumption of which is to conduct a survey among people who have passed a number of requirements allowing to obtain the title of a...
Open access
Research Article10.9734/jerr/2020/v17i317188
The development of new technology with thinner and smaller packages has become the movement and focus on semiconductor assembly industry. This paper presents an improvement done in dual-flat no-leads (DFN) package to resolve the quantity of rejection due to die attach film (DAF)...
Open access
Research Article10.9734/jerr/2020/v17i317189
Corona Virus Infectious Disease (COVID-19) is newly emerging infectious disease. It is known to the world in late 2019. Due to this, the mental health of employees is disturbed. There is always a fear of unemployment amongst employees due to the present scenario of lockdown. This...
Open access
Research Article10.9734/jerr/2020/v17i317190
With the new devices and new technologies in semiconductor industry are getting more challenging to process because of new processes and process bricks. One of the most challenging assembly processes is the pick and place or the die attach process. Issues were encountered during...
Open access
Research Article10.9734/jerr/2020/v17i317187