Enhanced Wirebonding Technique on QFN Device with Critical Die Reference
Jonathan C. Pulido, Frederick Ray I. Gomez
Journal of Engineering Research and Reports · pp. 57–61 · Published 11 Mar 2021
10.9734/jerr/2021/v20i317283Abstract
Wirebonding is one of the most challenging assembly manufacturing processes in semiconductor packaging industry. This paper discussed the wirebonding challenge and the solution to mitigate misplaced ball issues and prevent pattern recognition alignment errors. Parameter optimization particularly on wirebond looping was done to ensure that the silicon die’s L-fiducial is visible and not obstructed by the wires, which is the operator point or die reference of the unit during wirebonding setup. Ultimately, the optimized wirebonding parameter prevented the pattern recognition alignment error and misplaced ball issues during the lot process. For future works, the configuration and technique could be applied on packages with the similar situation.
Cited by 8
Jerome J. Dinglasan, Frederick Ray I. Gomez, Alyssa Grace S. Gablan · Journal of Engineering Research and Reports · 2021
Alyssa Grace Gablan, Jerome Dinglasan, Frederick Ray Gomez · Journal of Engineering Research and Reports · 2021
Jerome J. Dinglasan, Leandro D. Saria, Frederick Ray I. Gomez · Journal of Engineering Research and Reports · 2021
J. Pulido, F. R. Gomez, E. Graycochea Jr. · Journal of Engineering Research and Reports · 2021
Irish Beltran, Mark Anthony Ramiro, Jerome J. Dinglasan · Journal of Engineering Research and Reports · 2022
Jerome J. Dinglasan, Aiza Marie E. Agudon, F. Gomez · 2021
Showing 6 of 8 known citations — external sources report more than can currently be individually listed.
Related research
- Expanding Small UAV Capabilities with ANN: A Case Study for Urban Areas Inspection — shares topic coverage
- Comparative Analysis of Antihistamines and Nonsteroidal Anti-inflammatory Drugs (NSAIDs): Properties, Structure and Prediction of New Potential Drugs — shares topic coverage
- Emotional Trace: Mapping of Facial Expression to Valence-arousal Space — shares topic coverage
- Hybrid Pattern Recognition and Multi-resolution Analysis (MRA) Based Fault Location in Power Transmission Lines — shares topic coverage
- Eliminating Frequent Machine Assists through Process Plate Enhancement on Wirebonding Process — shares topic coverage
Article metrics
Real usage data collected on this platform.
97
Page views
0
PDF downloads
26
Outbound clicks
8
Citations
Views over time
Views by country
Approximate, from request IP at view time — not citizenship or institution. Countries with fewer than 5 views are grouped as "Other".
Traffic sources
Referring site, by host.
Views and downloads exclude known bots/crawlers. Citations combines this platform's own DOI-resolved index with each external source's own reported total — see Cited by above for individually listed citing works. Last refreshed 0 seconds ago.