Die Attach Process Robustness through Epoxy Pattern Optimization for DFN Device
Jerome J. Dinglasan, Frederick Ray I. Gomez
Journal of Engineering Research and Reports · pp. 59–63 · Published 21 Apr 2021
10.9734/jerr/2021/v20i517313Abstract
As the modern world evolves through innovation and technology, manufacturing companies of semiconductor drive their people to dedicate themselves on continuous improvement and technical advancement. Products they produce becomes smaller and thinner, but applications are limitless and innovative. In manufacturing of quad flat no lead packages, challenges were encountered during the die attach process especially in small die size. Die attach material overflow on pad is one of these, and certain parameters and techniques are explored to have a quality and robust process. Defining appropriate epoxy pattern with respect to the die size is a big factor to make sure no epoxy material will flow outside the die pad perimeter that may cause unit rejection. This paper will discuss the related issues of the said package by performing experiments and applying certain techniques to address the problem.
References (9)
- 1 Pick-and-Place Silver Sintering Die Attach of Small-Area Chips [DOI]
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Cited by 2
Jerome J. Dinglasan, Leandro D. Saria, Frederick Ray I. Gomez · Journal of Engineering Research and Reports · 2021
Maria Virginia S. Buera, Mariane A. Mendoza, F. Gomez · 2021
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