Richard G. Mariano

Enhanced Ball Shear Testing Configuration For Substrate LGA Sensor Devices

Richard G. Mariano, Marciano M. Maniebo & Frederick Ray I. Gomez · Journal of Engineering Research and Reports · 2021

Semiconductor assembly mass production environment has means of testing and verifying bond consistency and reliability during wire bonding. Common bond integrity assessment is ball shear testing (BST). This test enables analysis of the strength between the bond pad and a ball bon...

Open access Research Article 10.9734/jerr/2021/v20i1117407

Elimination of Non-stick on Leads Defect through Re-designed WCTP

Richard G. Mariano, Alyssa Grace S. Gablan & Frederick Ray I. Gomez · Journal of Engineering Research and Reports · 2021

This paper presents the reformation and fabrication resolved on the wire clamp and top plate (WCTP) design to eliminate the presence of lead finger bouncing resulting to high rejection of non-stick on leads (NSOL). Problem experienced was that the hollow or half-etched portion of...

Open access Research Article 10.9734/jerr/2021/v20i1017385