Rey Nino C. Arnido

“Rey Resin Dispense Pattern” A Solution to Package Voids Defect on Thinner Package Thickness in Compression Mold

Lester Joseph T. Belalo & Rey Nino C. Arnido · Journal of Engineering Research and Reports · 2021

This paper will discuss how package voids Mold defect was addressed on thinner Compression mold packages like BGA (Ball Grid Array) and Sensor Devices. Significant action was the application of “Rey Resin Dispense” pattern in compression mold granule compound dispensing was a key...

Open access Research Article 10.9734/jerr/2021/v20i217264

Expanded Usage Window of Molding Compound to Reduce Material Wastage in Manufacturing Line

Roland Soriano, Lester Joseph T. Belalo & Rey Nino C. Arnido · Journal of Engineering Research and Reports · 2021

This paper discusses about direct material wastage brought by expiring molding compound particularly for QFN-mr Packages. An Engineering problem solving methodology was used to identify the material, its consumption, cost, the root cause, and solution of the problem. The study ai...

Open access Research Article 10.9734/jerr/2021/v20i217266