Wire Shorting Defect Mitigation on Substrate LGA Device Through Wirebond Capillary Adjustment
Jonathan Pulido, Frederick Ray Gomez & Raymond Albert Narvadez · Journal of Engineering Research and Reports · 2021
Semiconductor packaging technologies are getting more challenging with regards to assembly manufacturing due to several factors such as complex package layout, process and machine capability, and materials compatibility. This paper discusses the wirebonding process difficulty and...
Open access
Research Article
10.9734/jerr/2021/v20i917367