Die Attach Assembly Process Tool Advancement
Frederick Ray Gomez, Rennier Rodriguez & Nerie Gomez · Journal of Engineering Research and Reports · 2020
Die attach film (DAF) voids detection is one of the challenges during the introduction of non-conductive adhesives for integrated circuit products affecting production control robustness and detection. In this paper, a specialized tool capable to distinguish and quantify the amou...
Open access
Research Article
10.9734/jerr/2020/v10i117031