Mark Anthony Ramiro

A Systematic Approach to Reduce Wirebond defects caused by Tight Wire Loop Profile on Ball Grid Array Packages

Irish Beltran, Mark Anthony Ramiro & Jerome Dinglasan · Journal of Engineering Research and Reports · 2022

Wirebond quality aspects on a semiconductor manufacturing is one of the key factors to be considered in having a robust product. Certain criteria are defined, met, and affects the output on the product. Other variables from downstream process are also taken in account to affect t...