Enhanced Ball Shear Testing Configuration For Substrate LGA Sensor Devices
Richard G. Mariano, Marciano M. Maniebo & Frederick Ray I. Gomez · Journal of Engineering Research and Reports · 2021
Semiconductor assembly mass production environment has means of testing and verifying bond consistency and reliability during wire bonding. Common bond integrity assessment is ball shear testing (BST). This test enables analysis of the strength between the bond pad and a ball bon...
Open access
Research Article
10.9734/jerr/2021/v20i1117407