This paper will discuss the improvement made to increase machine capacity in order to be prepare for incoming demand ramp-up and to free up machine allocation to back-up automotive machine. Using DMAIC methodology (Define, Measure, Analyze, Improve and Control) approach, mold cur...
Open access
Research Article10.9734/jerr/2021/v20i217272
This paper will discuss how package voids Mold defect was addressed on thinner Compression mold packages like BGA (Ball Grid Array) and Sensor Devices. Significant action was the application of “Rey Resin Dispense” pattern in compression mold granule compound dispensing was a key...
Open access
Research Article10.9734/jerr/2021/v20i217264
This paper discusses about direct material wastage brought by expiring molding compound particularly for QFN-mr Packages. An Engineering problem solving methodology was used to identify the material, its consumption, cost, the root cause, and solution of the problem. The study ai...
Open access
Research Article10.9734/jerr/2021/v20i217266