The Study of the Effect of Surfactants on Copper Codeposition with SiC Nano Particulate from Deep Eutectic Solvent Ionic Liquids (Ethaline)
K. El Ttaib & A. Benhmid · International Research Journal of Pure and Applied Chemistry · 2024
Here we investigate the electrolytic deposition of copper and copper nano composites in the absence and the presence of two types of surfactants: cationic which is sodium dodecyl sulphate (SDS) and the other type is cetyl trimethyl ammonium bromide (CTAB) from a solution of the...