Hynlie B. Inguin

Introduction of Laser Pi-Grooving as Breakthrough Solution to Enhance die Strength of 40 nm ulow-k CMOS Silicon Technology during Wafer Saw Process

Aiza Marie E. Agudon, Hynlie B. Inguin & Bryan Christian S. Bacquian · Journal of Engineering Research and Reports · 2021

Nowadays, semiconductors and electronics are becoming part of our everyday activities. As the Integrated circuits become more useful to people, it also requires more function, which contain more complex and compact components. Aligned to this package requirement, the more challen...