Laser DAF Cut: A Breakthrough Approach of Die Attach Film Singulation for Thin Wafers
Aiza Marie E. Agudon, Frederick P. Arellano & Bryan Christian S. Bacquian · Journal of Engineering Research and Reports · 2021
Today, semiconductor world is becoming more inclined to thinner Integrated Circuit (IC) packages. IC packages will require thinning of the internal configuration of the package, which involves the die or the wafer and the adhesive material, which is the Die Attach Film (DAF). Ali...
Open access
Research Article
10.9734/jerr/2021/v20i717343