Glue Voids Reduction on QFN Device through Material and Process Improvement
Edwin M. Graycochea Jr., Endalicio D. Manalo, Rennier S. Rodriguez & Frederick Ray I. Gomez · Journal of Engineering Research and Reports · 2021
The paper is focused on the glue voids reduction on critical semiconductor quad-flat no-leads (QFN) device processed on a stencil printing type of die attach machine. Process optimization through material preparation improvement was done to mitigate the silver lumps of the sinter...
Open access
Research Article
10.9734/jerr/2021/v20i317275