Viscoelastic Material Characterization: A Realistic Approach to Stress Analysis
Amor Zapanta & Jefferson Talledo · Journal of Engineering Research and Reports · 2021
This paper presents an advanced method in materials characterization for the mold compound material in semiconductor packages to build models that can technically explain the actual warpage or stress observations under different thermal conditions and time history. In the study,...
Open access
Research Article
10.9734/jerr/2021/v20i917381