Aiza Marie E. Agudon

Backside Chippings Improvement through Wafer Dicing Parameter Optimization and Understanding the Anistropic Silicon Properties

Aiza Marie E. Agudon & Bryan Christian S. Bacquian · Journal of Engineering Research and Reports · 2021

Semiconductor Companies and Industries soar high as the trend for electronic gadgets and devices increases. Transition from “manual” to “fully automatic” application is one of the advantages why consumer adapt to changes and prefer electronic devices as one of daily answers. Indi...

Open access Research Article 10.9734/jerr/2021/v20i717350

Laser DAF Cut: A Breakthrough Approach of Die Attach Film Singulation for Thin Wafers

Aiza Marie E. Agudon, Frederick P. Arellano & Bryan Christian S. Bacquian · Journal of Engineering Research and Reports · 2021

Today, semiconductor world is becoming more inclined to thinner Integrated Circuit (IC) packages. IC packages will require thinning of the internal configuration of the package, which involves the die or the wafer and the adhesive material, which is the Die Attach Film (DAF). Ali...

Open access Research Article 10.9734/jerr/2021/v20i717343

Introduction of Laser Pi-Grooving as Breakthrough Solution to Enhance die Strength of 40 nm ulow-k CMOS Silicon Technology during Wafer Saw Process

Aiza Marie E. Agudon, Hynlie B. Inguin & Bryan Christian S. Bacquian · Journal of Engineering Research and Reports · 2021

Nowadays, semiconductors and electronics are becoming part of our everyday activities. As the Integrated circuits become more useful to people, it also requires more function, which contain more complex and compact components. Aligned to this package requirement, the more challen...

Open access Research Article 10.9734/jerr/2021/v20i517308