Glass Die Ink Marking Media Selection for a Robust Glass Attach Process
Jerome Dinglasan, Aiza Marie Agudon & Frederick Ray Gomez · Journal of Engineering Research and Reports · 2021
Glass material used on a semiconductor device for isolating currents are one of the new breakthroughs of the modern world. Challenges are inevitable due to its complex characteristics and unique appearance. The study focuses on the phenomenon of reject glass die unrecognized, pic...
Open access
Research Article
10.9734/jerr/2021/v20i817365